IQC incoming material detection: to prevent poor process due to poor materials, and delay delivery;

SPI solder paste detection: in advance to find the front-end process out of the next process (inspection standard: 3D detection + data statistical analysis);

Online AOI testing: check whether there are mistakes, leaks, adverse materials out of the next process;

SMT first piece test: ensure that the components attached to the production model are completely consistent with the customer's assembly drawing and bill of materials, to prevent defects from flowing into the next process (refer to BOM and Gerber data, test each solder spot of the first piece board);

Appearance inspection: sampling inspection of all production processes, whether it is consistent with the operation instruction (effect standard: each product process instruction and each post instruction);

X-ray welding detection: detect the solder joints of components invisible to the naked eye to avoid the virtual welding short circuit out of the next process;

BGA device repair: X-ray detection of poor BGA welding, disassembly and welding under temperature controlled conditions, mitigate the impact on the device and ensure the quality of repair welding;

QA inspection: standardize the inspection of finished products to prevent unqualified products from being shipped;

Anti-static storage and delivery: anti-static packaging and safe storage protection.